Automated Optical Inspection
for Microelectronics
Quick Set-up
High Defect Coverage
High Speed
Supports Multiple Bonders
Low Cost of Ownership
Intuitive User Interface
Download
Specification Sheet (PDF)
YESTech’s YTV M1m, with advanced Thin Camera™ technology, offers high-speed microelectronic device
inspection with exceptional defect coverage. With 3 micron pixel resolution and telecentric optics, the M1m inspects bond wires, die placement, epoxy, underfill, SMT components and substrates, all within a footprint less than 1 sq. meter. The M1m can be placed in-line with your wire bonders or off-line to support several bonders. Options include magazine loader and unloader as well as offline programming, defect review and rework stations.
Programming the M1m is fast and intuitive. With CAD data input, a complete recipe can be completed in less than 1 hour. The offline programming option allows the engineer to create complete recipes at any remote location, without affecting production.
The M1m utilizes several image processing algorithms to perform a multitude of inspections historically performed manually by operators using eyepiece microscopes. Real-time color, normalized gray scale correlation,pattern matching and binary "blob" analysis are just a few of the tools used to automate the process. The M1m also features 25mm Z-axis optical motion with 1 micron resolution and AUTOFOCUS. This feature is critical for the inspection of complex multichip modules.
YESTech's M1m also provides you with SPC data, defect reports, offline defect classification, offline rework capability and even archived images of every device you inspect. In addition, YESTech also provides free software upgrades for the life of the system.
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